Die stitching and harvesting of arrayed structures

ABSTRACT

Multi-die structures with die-to-die routing are described. In an embodiment, each die is patterned into the same semiconductor substrate, and the dies may be interconnected with die-to-die routing during back-end wafer processing. Partial metallic seals may be formed to accommodate the die-to-die routing, programmable dicing, and various combinations of full metallic seals and partial metallic seals can be formed. This may also be extended to three dimensional structures formed using wafer-on-wafer or chip-on-wafer techniques.

RELATED APPLICATIONS

This application claims the benefit of priority of co-pending U.S.application Ser. No. 17/133,096 filed Dec. 23, 2020, which is hereinincorporated by reference.

BACKGROUND Field

Embodiments described herein relate to integrated circuit (IC)manufacture, and the interconnection of multiple dies.

Background Information

Microelectronic fabrication of ICs is typically performed using asequence of deposition and patterning of circuit elements in alayer-by-layer sequence in which a stepper (or scanner) is used to passlight through a reticle, forming an image of the reticle pattern on anunderlying layer. Rather than expose an entire wafer, the stepper movesin steps across the wafer from one die area location to another. In thismanner, working on a limited area enables higher resolution and criticaldimensions. Dies can then be scribed from the wafer and furtherpackaged.

A multi-chip module (MCM) is generally an electronic assembly in whichmultiple dies are integrated on a substrate. Various implementations ofMCMs include 2D, 2.5D and 3D packaging. Generally, 2D packaging modulesinclude multiple dies arranged side-by-side on a package substrate. In2.5D packaging technologies multiple dies and bonded to an interposerwith microbumps. The interposer in turn is then bonded to a packagesubstrate. The interposer may include routing to interconnect theadjacent die. Thus, the dies in 2.5D packaging can be directly connectedto the interposer, and are connected with each other through routingwithin the interposer. Generally, 3D packaging modules include multipledies stacked vertically on top of each other. Thus, the die in 3Dpackaging can be directly connected to each other, with the bottom diedirectly connected to a package substrate. The top die in a 3D packagecan be connected to the package substrate using a variety ofconfigurations, including wire bonds, and through-silicon vias (TSVs)though the bottom die.

More recently it has been proposed in U.S. Pat. No. 10,438,896 toconnect adjacent dies formed in the same substrate with stitch routing.Thus, the back-end-of-the-line (BEOL) build-up structure commonlyreserved for individual die interconnection can be leveraged to fordie-to-die routing to connect adjacent die areas in the same substrate.In this manner, die sets can be scribed from the same wafer.Furthermore, these die sets can be larger than a single reticle size.These die sets can then be further integrated in various modules orsemiconductor packages.

SUMMARY

Multi-device structures are described in which the devices, includingdies and other components, are harvested from arrayed structures.Adjacent devices within a harvested die set or component set can beco-located or connected together with die-to-die orcomponent-to-component routing. Partial metallic seals may also beformed to accommodate the die-to-die routing or component-to-componentrouting, and various combinations of full metallic seals and partialmetallic seals can be formed. Programmable dicing techniques canadditionally be employed to selectively scribe custom die/componentsets, at high densities and without being limited to a specific scribesize or shape. Furthermore, programmable dicing techniques can also beused to scribe unique structures where additional area or structure canbe included in the scribed die set adjacent to a partial metallic sealto provide further protection from environment (e.g. moisture, ions),stress, and micro-cracks.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A-1B are schematic top view layout plan illustrations of a waferincluding an array of front-end-of-the-line (FEOL) die areas inaccordance with embodiments in which adjacent FEOL die areas areinterconnected with die-to-die routing.

FIG. 1C is a schematic top view layout plan illustration of a waferincluding an array of FEOL die area sets in accordance with anembodiment in which the FEOL die area sets are interconnected withdie-to-die routing.

FIG. 2 is a schematic top view illustration of a plurality of adjacentFEOL die areas in accordance with an embodiment in which die-to-dierouting extends through partial metallic seal rings around the FEOL dieareas.

FIG. 3 is a schematic cross-sectional side view illustration of astitched die structure in accordance with an embodiment.

FIG. 4 is a schematic cross-sectional side view illustration of a chipincluding a stitched die structure in accordance with an embodiment.

FIG. 5A is a flow chart of a method of testing and scribing dies withpre-formed die-to-die routing extending through partial metallic sealrings accordance with embodiments.

FIG. 5B is a schematic top view illustration of a die including scribeddie-to-die routing in accordance with an embodiment.

FIG. 6A is a flow chart of a method of testing and scribing dies withfull metallic seal rings accordance with embodiments.

FIG. 6B is a schematic top view illustration of a die including a fullmetallic seal ring in accordance with an embodiment.

FIG. 7 is a schematic top view illustration multi-component devicescaling with connected co-located components in accordance with anembodiment.

FIG. 8A is a schematic cross-sectional side view illustration of a chipincluding a plurality of multi-component devices in accordance with anembodiment.

FIG. 8B is a schematic cross-sectional side view illustration of apackage including a plurality of multi-component devices in accordancewith an embodiment.

FIG. 9 is a schematic bottom view illustration of a plurality ofmulti-component devices mounted on an underside of a die or package inaccordance with an embodiment.

FIG. 10 is a schematic top view illustration an irregular shapedmulti-component device mounted on an underside of a die or package inaccordance with an embodiment.

FIG. 11 is a schematic top view illustration of an irregular shapedmulti-component device scribe area from a component wafer in accordancewith an embodiment.

FIG. 12A is a schematic top view illustration multi-die set scaling withco-located dies and dies connected with die-to-die routing in accordancewith an embodiment.

FIG. 12B is a schematic top view illustration multi-die set scaling withdie-to-die routing in accordance with an embodiment.

FIG. 13A is a schematic top view illustration multi-die set scaling withco-located dies, dies connected with die-to-die routing, and stackeddies in accordance with an embodiment.

FIG. 13B is a schematic cross-sectional side view illustration ofwafer-on-wafer stacked die sets in accordance with an embodiment.

FIG. 13C is a schematic cross-sectional side view illustration of a chipincluding wafer-on-wafer stacked die sets in accordance with anembodiment.

FIG. 13D is a schematic top view illustration of a chip-on-wafer stackeddie set in accordance with an embodiment.

FIG. 13E is a schematic top view illustration of various possibleoutcomes for selecting stitched die sets onto which to mountchips-on-wafer in accordance with an embodiment.

FIG. 13F is a schematic cross-sectional side view illustration ofpackage including a chip-on-wafer stacked die set in accordance with anembodiment.

FIG. 13G is a schematic cross-sectional side view illustration ofpackage including a chip-on-wafer stacked die set in accordance with anembodiment.

FIG. 14A is a schematic top view illustration of a memory system withvarious examples of memory bandwidth and capacity scaling in accordancewith an embodiment.

FIG. 14B is a schematic cross-sectional side view illustration of thememory system of FIG. 14A in accordance with an embodiment.

FIGS. 15A-15B are close-up schematic top view illustrations ofharvesting network dies from a wafer in accordance with embodiments.

FIG. 15C is a close-up schematic top view illustration of a network diearea set in accordance with an embodiment.

FIG. 15D is a close-up schematic top view illustration of an array ofnetwork dies on a wafer in accordance with an embodiment.

FIG. 15E is an illustration of a module including a plurality of logicchips arranged around a harvested single die set network chip inaccordance with an embodiment.

FIG. 15F is an illustration of a module including a plurality of logicchips arranged around a harvested multi-die set network chip inaccordance with an embodiment.

FIG. 15G is schematic top view layout plan illustration of harvestingnetwork dies from wafer in accordance with an embodiment.

FIG. 15H is a schematic top view illustration of a die set includingmultiple network dies in accordance with an embodiment.

FIG. 16A is a schematic top view illustration of both logic and memoryscaling with stitched interfacing bars in accordance with an embodiment.

FIG. 16B is a schematic top view illustration of scribed interfacingbars in accordance with an embodiment.

FIG. 16C is a schematic cross-sectional side view illustration ofstitched interfacing bars in accordance with an embodiment.

FIG. 17A is a schematic cross-sectional side view illustration of amodule including a plurality of dies mounted on an interposer withconnected routing areas in accordance with an embodiment.

FIG. 17B is a schematic top view illustration of scribe areas on aninterposer substrate with connected routing areas in accordance with anembodiment.

FIG. 18 is a flow chart of a method of testing and scribing dies withprogrammable dicing in accordance with embodiments.

FIG. 19A is a schematic top view illustration of a die set beforescribing in accordance with an embodiment in which the FEOL die areasets are interconnected with die-to-die routing through partial metallicseal rings.

FIG. 19B is a schematic top view illustration of a scribe line throughdie-to-die routing between adjacent FEOL die areas in accordance with anembodiment.

FIG. 20A is a schematic top view illustration of a die set beforescribing in accordance with an embodiment with service structureslocated in an unscribed scribe area between adjacent FEOL die areas.

FIG. 20B is a schematic top view illustration of a scribed die set inaccordance with an embodiment with service structures located in ascribed scribe area between adjacent FEOL die areas.

FIG. 21 is a schematic top view illustration of a scribed die set inaccordance with an embodiment with scribe line on an opposite side of aninput/output region of an adjacent FEOL die area in accordance with anembodiment.

FIG. 22 is a schematic side view illustration of a chip mounted on arouting substrate including a covered bond pad in accordance with anembodiment.

FIG. 23 is a schematic side view illustration of the chip including thescribed die set of FIG. 21 mounted on a routing substrate with aconductive bump underneath the additional input/output region inaccordance with an embodiment.

DETAILED DESCRIPTION

Embodiments describe multi-device structures obtained from harvesting ofarrayed structures, and either co-locating the adjacent devices or usingstitching techniques to connect adjacent devices. Harvesting may includedicing the number of units required, or even having more units thanrequired and accepting one or more units that fail. Additionally,redundancy can be added by including one or more extra units (dies), orcomplete sub-systems. In event of a unit failure, a good unit can beswapped. Redundancy can be at the time of manufacture, or swappable inthe field. Various applications include harvesting of engines such asgraphics processing units (GPU), central processing units (CPU), signalprocessing engines, a neural engines (e.g. neural network processingengine), artificial intelligence (AI) engines, networks, caches, etc.,memory device such as static random-access memory (SRAM), magneticrandom-access memory (MRAM), nonvolatile random-access memory (NVRAM),dynamic random-access memory (DRAM), NAND, and cache memory, othercomponents such as a capacitor, inductor, resistor, power managementintegrated circuit (IC), amongst others including interfacing bars forlogic or memory expansion, and interposer substrates. Array harvestingmay also be extended to other applications including solar, display,probe pin arrays for automated test equipment (ATE), field programmablegate arrays (FPGA), etc.

In one aspect, embodiments describe multi-die structures includingcombinations of partial metallic seals (e.g. partial metallic sealrings) around or over certain edges of front-end-of-the-line (FEOL) dieareas in combination with full rings. In this manner, partial metallicseals can be located in areas where die-to-die or component-to-componentinterconnections are possible, while full metallic seals or metallicseal rings can be located around edges where such connections are notintended. In accordance with some embodiments, die-to-die routings(interconnects) or component-to-component routing (interconnects) can bepre-formed, and desired die sets can then be scribed from a sourcewafer. Scribing may optionally include cutting through the die-to-dierouting.

In another aspect, embodiments describe programmable dicing techniqueswhere traditional dicing techniques such as blade sawing will not work.For example, this may include laser assisted dicing or chemical etchdicing flows to carve out specific die-set areas, which can also beirregularly shaped. Laser techniques may be ablation based (evaporatethe material) or stealth (damage the semiconductor wafer, thenfracture). Chemical may be wet etch or plasma etch, particularly if thesemiconductor wafer (silicon) is deep (e.g. more than 50 μm). Thus, suchprogrammable dicing techniques can facilitate harvesting of arrayedstructures. Furthermore, such programmable dicing techniques canfacilitate dicing through non-conventional FEOL die areas. For example,dicing can be performed through a portion of an adjacent FEOL die areaof a die that is to be scrapped in order to increase chip edge to activearea distance of the harvested die, and provide further protection tomoisture, ions, cracks where a partial metallic seal ring may bepresent.

In various embodiments, description is made with reference to figures.However, certain embodiments may be practiced without one or more ofthese specific details, or in combination with other known methods andconfigurations. In the following description, numerous specific detailsare set forth, such as specific configurations, dimensions andprocesses, etc., in order to provide a thorough understanding of theembodiments. In other instances, well-known semiconductor processes andmanufacturing techniques have not been described in particular detail inorder to not unnecessarily obscure the embodiments. Reference throughoutthis specification to “one embodiment” means that a particular feature,structure, configuration, or characteristic described in connection withthe embodiment is included in at least one embodiment. Thus, theappearances of the phrase “in one embodiment” in various placesthroughout this specification are not necessarily referring to the sameembodiment. Furthermore, the particular features, structures,configurations, or characteristics may be combined in any suitablemanner in one or more embodiments.

The terms “above”, “over”, “to”, “between”, “spanning” and “on” as usedherein may refer to a relative position of one layer with respect toother layers. One layer “above”, “over”, “spanning” or “on” anotherlayer or bonded “to” or in “contact” with another layer may be directlyin contact with the other layer or may have one or more interveninglayers. One layer “between” layers may be directly in contact with thelayers or may have one or more intervening layers.

Referring now to FIGS. 1A-1B schematic top view layout planillustrations are provided of a wafer 102 (e.g. silicon) including anarray of dies 104 in which the adjacent FEOL die areas 110 of the dies104 can be interconnected with die-to-die routing 130. The separate FEOLdie areas 110 and dies 104 in accordance with embodiments describedherein (not limited to FIGS. 1A-1B) may include distinct circuit blocksfrom one another. Each die area 110 may represent a complete system, orsub-system. Adjacent die areas 100 may perform the same or differentfunction. In an embodiment, die area 110 interconnected with die-to-dierouting can include a digital die area tied to a die area with anotherfunction, such as analog, wireless (e.g. radio frequency, RF) orwireless input/output, by way of non-limiting examples. The tied dieareas 110 may be formed using the same processing nodes, whether or nothaving the same or different functions. Whether each die 104 and diearea 110 includes a complete system, or are tied subsystems, thedie-to-die routing 130 may be inter-die routing (different systems) orintra-die routing (different, or same subsystems within the samesystem). For example, intra die-to-die routing may connect differentsubsystems within a system on chip, SOC, where inter die-to-die routingcan connect different SOCs, though this is illustrative, and embodimentsare not limited to SOCs.

In accordance with embodiments, any or all FEOL die area edges can beconfigured to include die-to-die routing 130. Furthermore, each FEOL diearea 110 may be surrounded by metallic seal 122 (e.g. metallic sealring), which can be a partial or full metallic seal. In an embodiment,partial metallic seals (or partial metallic seal rings) may be providedaround or over FEOL die area edges where die-to-die routing 130 can beformed. As shown in FIG. 1A, dicing or scribe lanes can be locatedanywhere to accommodate yield (e.g. bad dies) or demand (e.g. need forlarger die sets). As shown in FIG. 1B, the harvesting techniques inaccordance with embodiments can facilitate improved wafer utilization,and harvesting of more dies or components. For example, this may beaccomplished by being able to harvest die sets of different or irregularshapes, as well as utilizing programmable dicing methods. It is to beappreciated that while the following description is made with specificregard to interconnection of adjacent FEOL die areas with die-to-dierouting 130, such a configuration is also applicable to interconnectionof adjacent component areas with component-to-component routing.

FIG. 1C is a schematic top view layout plan illustration of a waferincluding an array of pre-arranged die sets 100 in accordance with anembodiment in which the die sets 100 are interconnected with die-to-dierouting 130. While the array of FEOL die areas 110 illustrated in FIGS.1A-1B can allow for complete flexibility with scribing any combinationof interconnected die sets, embodiments such as that illustrated in FIG.1C also contemplate the arrangement of specific die sets connected withdie-to-die routing. In such an embodiment, full metallic seal rings 122Bcan be provided around the die sets 100, while partial metallic seals122A are provided between adjacent FEOL die areas 110 within the diesets 100. Such a configuration may allow for complete metallic sealingof the scribed die sets, while still allowing for flexibility ofscribing through the die-to-die routing 130 between adjacent FEOL dieareas to facilitate improved wafer utilization. For example, suchscribing may be performed to harvest a single die 104, remove a bad die104, or harvest an irregular shape or custom number of dies 104 in a dieset 100. As a contrast with FIG. 1A, which may be across multiplereticles, the embodiment illustrated in FIG. 1C may be within a reticlesuitable for smaller systems. Staying within reticle may allow simplerstitching interconnection. Dicing can also be through the die-to-dierouting 130 between die areas.

In order to illustrate flexibility of integrating partial and fullmetallic seals reference is made to FIG. 2 . As shown, die-to-dierouting 130 can extend through partial metallic seals 122A betweenadjacent FEOL die areas 110A, 110B, 110C, 110D, of dies 104A, 104B,104C, 104D and full metallic seals 122B can optionally be arrangedadjacent FEOL die area 110A, 110B, 110C, 110D edges that are notinterconnected with die-to-die routing 130. Each die can include an FEOLdie area that includes a device area 112 and input/output region(s) 114.The metallic seals in accordance with embodiments may provide physicalprotection (e.g. from environment (e.g. moisture, ions), stress,micro-cracks, delamination) and/or electrical protection (e.g.electromagnetic interference, electrostatic discharge). Thus, partialmetallic seals 122A can be incorporated to provide design flexibilityfor harvesting interconnected die sets, while full metallic seals 122Bcan be incorporated to provide more robust physical and/or electricalprotection to the die sets 100.

FIG. 2 also illustrates that the die sets 100 can include dies withdifferent shapes (e.g. different sized FEOL die areas 110) as well as,the same or different types and function of dies. As previouslydescribed with regard to FIGS. 1A-1B, the separate FEOL die areas 110A,110B, 110C, 110D and dies 104A, 104B, 104C, 104D may include distinctcircuit blocks from one another. Each die area may represent a completesystem, or sub-system. Adjacent die areas may perform the same ordifferent function. In an embodiment, die areas 110A, 110B, for example,interconnected with die-to-die routing can include a digital die areatied to a die area with another function, such as analog, wireless (e.g.radio frequency, RF) or wireless input/output, by way of non-limitingexamples. The tied die areas may be formed using the same processingnodes, whether or not having the same or different functions. Whethereach die and die area includes a complete system, or are tiedsubsystems, the die-to-die routing 130 may be inter-die routing(different systems) or intra-die routing (different, or same subsystemswithin the same system). For example, intra die-to-die routing mayconnect different subsystems within a system on chip, SOC, where interdie-to-die routing can connect different SOCs, though this isillustrative, and embodiments are not limited to SOCs. In an embodiment,a die set 100 includes both digital and analog or wireless die areas110. In an embodiment, the different dies 104 with a die set 100 caninclude multiple engines, such as a graphics processing unit (GPU), acentral processing unit (CPU), a neural engine (e.g. neural networkprocessing engine), an artificial intelligence (AI) engine, a signalprocessor, networks, caches, and combinations thereof. However,embodiments are not limited to engines, and may include memory devices,such as SRAM, MRAM, DRAM, NVRAM, NAND, cache memory, or other componentssuch as a capacitor, inductor, resistor, power management integratedcircuit (IC), amongst others.

Referring now to FIG. 3 in combination with FIG. 2 , a schematiccross-sectional side view illustration is provided of s stitched diestructure in accordance with an embodiment. As shown, each FEOL die area110A, 110B is formed in the same (semiconductor) substrate 101, such asa silicon wafer. Each FEOL die area 110A, 110B can include the activeand passive devices of the dies. A back-end-of-the-line (BEOL) build-upstructure 120 is then formed over the semiconductor substrate 101 toprovide electrical interconnections and metallic seal structures. TheBEOL build-up structure 120 may conventionally fulfill the connectivityrequirements of the die. In accordance with embodiments, connectivity ofthe BEOL build-up structure 120 is extended to connect different dies.The BEOL build-up structure 120 may be fabricated using conventionalmaterials including metallic wiring layers (e.g. copper, aluminum, etc.)and insulating interlayer dielectrics (ILD) such as oxides (e.g. siliconoxide, carbon doped oxides, etc.), nitrides (e.g. silicon nitride),low-k, materials, etc.

The die-to-die routing 130 may include die routing 135 from each dieconnected with stitch routing 136. In accordance with embodiments, thedie routing 135 may be formed from one or more vias 132 and metal layers134 within the BEOL build-up structure 120. In the particular embodimentillustrated, the die-to-die routing 130 includes multiple routings,formed within multiple metal layers. In accordance with embodiments, thedie-to-die routing 130 can be formed within the lower metal layersM_low, upper metal layers M_high, midlevel metal layers M_mid, andcombinations thereof. Generally, the lower metal layers M_low have finerline widths and spacing. Additionally, the interlayer dielectrics (ILDs)for the lower metal and midlevel metal layers may be formed of low_kmaterials, which can allow quicker moisture transport. Thus, when usingthe finer wiring layers, additional precautions can be taken inaccordance with embodiments, such as passivation of diced chip edges.This may be attributed to making connections between devices. The uppermetal layers M_high may have coarser line widths and line spacing, withthe midlevel metal layers M_mid having intermediate line widths andspacing. In an embodiment, upper metal layers M_high may be primarilyused for die-to-die routing 130 for lower resistance wiring, andpossibly greater flexibility to form custom die sets with dynamicdie-to-die routing 130 after testing. In accordance with embodiments,the die-to-die routing 130 extends through one or more openings 123 inthe partial metallic seals 122A to electrically connect the dies 104.The BEOL build-up structure 120 may additionally include a plurality ofcontact pads 140 such as, but not limited to, under bump metallurgypads, which may be electrically connected to the first and second die104A, 104B, and optionally the metallic seals 122A, 122B.

Still referring to FIGS. 2-3 , die sets 100 including stitched multi-diestructures in accordance with embodiments may include a firstfront-end-of-the line (FEOL) die area 110A of a first die 104A patternedinto a semiconductor substrate 101 and a second FEOL die area 110B of asecond die 104B patterned into the semiconductor substrate 101, with thesecond FEOL die area 110B being separate from the first FEOL die area110A. The first FEOL die area can include a first input/output region114, and the second FEOL die area can includes a second input/outputregion 114. The BEOL build-up structure 120 additionally spans over thefirst FEOL die area 110A and the second FEOL die area 110B. As shown inboth FIGS. 2-3 a first partial metallic seal 122A may be adjacent to thefirst input/output region 114 of the first FEOL die area 110A, and asecond partial metallic seal 122A may be adjacent to the secondinput/output region 114 of the second FEOL die area 110B. As shown inboth FIGS. 2 and 3 , die-to-die routing 130 connects the firstinput/output region 114 and the second input/output region 114 andextends through first openings 123 in the first partial metallic seal122A and second openings 123 in the second partial metallic seal 122A.In an embodiment, the openings 123 are lateral openings. For example,the openings 123 may be similar to a gate opening in a fence. In anembodiment, the openings 123 are vertical openings. For example, theopenings 123 may be similar to a window in a wall between a floor andceiling, or open kitchen service counter for illustrative purposes.Openings 123 can assume different shapes, and combinations of lateraland vertical characterizations.

As shown in FIG. 2 , each die 104 may include a partial metallic seal122A adjacent to a portion or side/periphery of the die, adjacentmultiple sides, or around all sides. Each die 104 may include acombination of full metallic seals 122B and partial metallic seals 122Ato accommodate die-to-die routing 130. Furthermore, larger full metallicseals 122B can be formed around multiple dies, such as in FIG. 1C wherefull metallic seal rings 122B are provided around the die sets 100,while partial metallic seals 122A are provided between adjacent FEOL dieareas 110 within the die sets 100 that may be stitched together. Avariety of combinations are possible.

FIG. 4 is a schematic cross-sectional side view illustration of a chip150 including a stitched die structure in accordance with an embodiment.The particular embodiment illustrated includes a die set 100 similarthat of FIG. 3 and FIG. 1C, which can be diced from the semiconductorwafer 102. The chip 150 can be further packaged, or a pluralityconductive bumps (e.g. solder) 142 can be provided to contact pads 140.The illustration of FIG. 4 differs from the schematic of FIG. 3 andshows more traditional damascene structures for vias 132 and metallayers 134 within the BEOL build-up structure 120. Additionally,vertical openings 123 are illustrated within the partial metallic seals122A to accommodate the die-to-die routing 130.

FIG. 5A is a flow chart of a method of testing and scribing dies withpre-formed die-to-die routing 130 extending through partial metallicseals 122A accordance with embodiments. Referring briefly back to FIGS.1A-1C and FIG. 2 , exemplary arrangements are provided with differentarrangements of partial metallic seals 122A and full metallic seals122B. In an exemplary fabrication sequence at operation 5010 the BEOLbuild-up structure 120 is formed to include pre-formed die-to-dierouting 130 extending through partial metallic seals 122A. Theindividual dies 104 can then be tested at operation 5020. Testing may beperformed at wafer level with contacting circuit probes with die testpads, which can be interspersed with contact pads 140. In thisarrangement, the partial metallic seals 122A can allow connectivitybetween the dies and a test engine on the wafer to enhance testing. Inaccordance with embodiments, testing may be used to bin the dies intogroups, for example, to identify good and bad die clusters. Die sets 100within good clusters may then be dynamically scribed out into specifiedstitched die structures at operation 5030.

Up until this point the die sets 100 illustrated in FIGS. 2 and 3 do notshow scribing through the die-to-die routing 130. However, scribing orcutting may also be performed through die-to-die routing 130 whenscribing die sets 100 or individual dies 104. FIG. 5B is a schematic topview illustration of chip 150 included a harvested die 104 with scribeddie-to-die routing 130 in accordance with an embodiment. As shown inFIG. 5B scribing may be accompanied by cutting through the die-to-dierouting 130, or more specifically through stitch routing 136, oroptionally die routing 135, or both. Scribing through the die-to-dierouting 130 may then result in terminal ends 137 of the die-to-dierouting (which is now unconnected between dies), which will thus bealong a diced edge 152 of the resultant chip 150 or package. However,since this cut portion of the die-to-die routing 130 will not be used,this may not affect performance of the stitched die 104. In anembodiment, the die-to-die routing 130 lines (and associated powersupply network), which have been cut, are electrically isolated.Isolation can include being tristated, or otherwise being disconnectedfrom the core circuits of the die. Following dicing the die 104 or diesets 100 may be further integrated as discrete chips 150 or subjected tofurther packaging sequences.

In an embodiment, a chip 150 structure may include a semiconductorsubstrate 101, a first FEOL die area 110 (e.g. 110A, FIG. 2 ) of a firstdie 104 patterned into the semiconductor substrate 101, with the firstFEOL die area 110 including a first device area 112 and a firstinput/output region 114. A BEOL build-up structure 120 spans over thefirst device area 112 and the first input output region 114, and a chipedge 152 is adjacent to the first input output region 114. In thisexample, it can be assumed dicing is between dies 104A, 104B of FIG. 2 .In accordance with embodiments, the BEOL build-up structure 120 includesa die-to-die routing 130 connected between the first input/output region114 and a terminal end 137 of die-to-die routing 130 at the chip edge152 (See FIG. 5B). In an embodiment, the first input/output region 114connected to the die-to-die routing 130 is isolated in an off state.Isolation can include being tristated or otherwise being disconnectedfrom the core circuits of the die. As shown, the BEOL build-up structure120 can include a first partial metallic seal 122A adjacent to the firstinput/output region 114, with the die-to-die routing 130 extendingthrough first openings 123 in the first partial metallic seal 122A.

Die-to-die routing 130 may be included along one, a plurality, or alldie edges. In an embodiment, a second FEOL die area 110 (e.g. 110C, FIG.2 ) of a second die 104 may also be patterned into the samesemiconductor substrate 101, with the second FEOL die area 110 includinga second device area 112 and a second input output region 114. In anembodiment, the first FEOL die area 110 (e.g. 110A) includes a thirdinput/output region 114, and the BEOL build-up structure 120 spans overthe second FEOL die area 110 (e.g. 110C), the second input/output region114, and the third input/output region 114, and the BEOL build-upstructure 120 additionally includes a second die-to-die routing 130connected between the second input/output region and the thirdinput/output region. Further, a second partial metallic seal 122A may beadjacent to the second input/output region 114 and a third partialmetallic seal 122A may be adjacent to the third input/output region 114,with the second die-to-die routing 130 extending through second openings123 in the second partial metallic seal 122A and through third openings123 in the third partial metallic seal 122A.

Thus far embodiments have been described in which the die-to-die routing130 and metallic seals are pre-formed. In alternative processingsequences, custom seal rings can be formed after die testing. FIG. 6A isa flow chart of a method of testing and scribing dies with full metallicseals 122B accordance with embodiments. FIG. 6B is a schematic top viewillustration of a die 104 including a full metallic seal 122B inaccordance with an embodiment, which may be fabricated using thesequence of FIG. 6A. At operation 6010 the BEOL build-up structure 120is only partially formed. That is, a significant portion of the metalrouting is formed, yet processing has not continued to the point offabricating the bond pads. At this stage processing of the metal routinghas not yet reached the point for conventional wafer testing methods. Atoperation 6020 die clusters are binned (e.g. identified as good or bad)based on process data. For example, the process data may be based onearly electrical test data from front-end-of-the-line (FEOL) and/orearly BEOL fabrication stages, optical test data, and yield trends forwafer die location. Data may include electrical test or opticalinspection data. For example, electrical test data may include probed(touch) tests to determine electrical quality of transistors orinterconnects, simple circuits (e.g. ring oscillator or the like).Probed touchdown testing may be accompanied by a subsequent clean/repairoperation. No-touch testing may also be utilized to bin the dies.Exemplary no-touch testing methods include optical inspection, andsystematic (e.g. wafer maps) and historical trends, and project yield toidentify the die sets. No-touch testing may include radio frequency, oroptical probes, or probing on a remote area with test signals propagatedto the die under test. Based on this information, the formation of theBEOL build-up structure 120 is completed at operation 6030 to includedie-to-die routing 130 between specified die sets. Dies 104 within badclusters may not be interconnected. Specifically, stitch routing 136 maynot be formed over pre-formed die routing 135 as shown in FIG. 6B, whichcan remain unconnected and buried inside the BEOL build-up structure120. In some embodiments, full metallic seals 122B are only formedaround the specified die sets that will become the stitched die sets 100at operation 6040, or single die sets as shown in FIG. 6B. In thismanner, the uncommitted layers of the BEOL build-sup structure 120 canthen be used to form the custom metallic seals, routings, and die sets.The die sets 100 are then scribed at operation 6050.

The harvesting methods in accordance with embodiments can be used forintegration of a variety of arrayed structures of other components whichmay be active or passive, such as capacitors, inductors, resistors,power management integrated circuits (ICs), amongst others includinginterfacing bars for logic or memory expansion. Active structuresinclude silicon-based structures as well as other types of materialssuitable for electronic devices such as GaAs, InP, etc. Array harvestingmay also be extended to other applications including solar, display,prob pin arrays for automated test equipment (ATE), field programmablegate arrays (FPGA), etc.

FIG. 7 is a schematic top view illustration multi-component devicescaling with connected/stitched co-located components 210 in accordancewith an embodiment. The general idea of FIG. 7 is similar to the dieharvesting idea of FIGS. 1A-1C, where it is shown that multi-componentdevices 200 can be harvested from a substrate including an array ofcomponents 210. Similarly, the components can have pre-fabricatedcomponent-to-component routing 230, or can have customcomponent-to-component routing as previously described with the die sets100. Multiple components 210 can be interconnected in a multi-componentdevice 200 using component-to-component routing 230, for example forcapacity scaling. For example, where the components 210 are passivedevices such as resistors, capacitors, or inductors, the components 210can be appropriately connected to obtain desired properties (e.g.parallel capacitors to increase capacitance). Physical properties likeaspect ratio, or other desirable non-rectangular shapes may be feasible.Similarly, other passive properties may be suitably tailed, such asinductance, resistance, etc. In such an embodiment, the multi-componentdevice 200 may have shared terminals 205 (see FIGS. 8A-8B) for mountingon a chip or package with microbumps 190. Alternatively, each of thecomponents 210 can be co-located and not electrically connected to oneanother. In such a circumstance, the components 210 within amulti-component device 200 can each have their own terminals 205. Asshown, the component harvesting can be used to select different sizes orshapes of components and component sets.

Referring now to FIG. 8A, a schematic cross-sectional side viewillustration is provided of a chip 150, such as that previouslydescribed with regard to FIG. 4 , including a plurality ofmulti-component devices 200 in accordance with an embodiment. As shown,the multi-component devices 200 can be mounted onto an underside 121 ofthe BEOL build-up structure 120 adjacent to the conductive bumps 142.The multi-component devices 200 may have different sizes and/or shapesdepending upon function. For example, size and shape may be selecteddepending upon function, capacity, or matching an area of a circuitblock (also referred to as an intellectual property (IP) block, orfunctional block) within the chip.

FIG. 8B is a schematic cross-sectional side view illustration of apackage 250 including a plurality of multi-component devices 200 inaccordance with an embodiment. In the exemplary embodiment illustrated,the package 250 can include one or more chips 150 encapsulated in amolding compound layer 160. A redistribution layer (RDL) 170 can then beformed over the active side faces of the chips 150 and the moldingcompound layer 160. The redistribution layer may include a plurality ofdielectric layers 173 and electrical routing layers 175 (e.g. copper,aluminum, etc.) and a plurality of bond pads 172 on the underside 171 ofthe RDL 170. Similar to the chip 150 structure of FIG. 8A, one or moremulti-component devices 200 can be mounted onto an underside 171 of theRDL 170 adjacent to the conductive bumps 174 (e.g. solder bumps).

FIG. 9 is a schematic bottom view illustration of a plurality ofmulti-component devices 200 mounted on an underside 121, 171 of a chip150 or package 250 in accordance with an embodiment. As shown, the sizeor shape of each multi-component devices 200 can be different. Eachmulti-component devices 200 may additionally include a set of co-locatedcomponents 210, which can be connected together or not.

In an embodiment, an electronic structure (e.g. chip, package) includesa routing layer (e.g. BEOL build-up structure 120 or RDL 170), and oneor more dies on a top side of the routing layer. For example, the diescan be within one or more chips 150. A plurality of conductive bumps142, 174 are on the underside of the routing layer, and amulti-component device 200 is bonded to the underside of the routinglayer laterally adjacent to the plurality of conductive bumps. Inaccordance with embodiment, the multi-component device 200 includes aplurality of co-located components 210. Each component 210 mayoptionally be formed in the same substrate, such as the silicon wafer102 for the FEOL die areas 110 previously described. In an embodiment,each component 210 of the plurality of co-located components includesseparate (distinct) terminals. In an embodiment, the plurality ofco-located components includes component-to-component routing 230. In anembodiment, the components 210 can be passive components, such as acapacitor, an inductor, or a resistor. The components 210 can be otherdevices, such as power management ICs.

Referring now to FIG. 10 , a schematic top view illustration is providedof an irregular shaped multi-component device 200 mounted on anunderside of a die or package in accordance with an embodiment. Asshown, the FEOL die area 110 of the die or a die within the package caninclude a plurality of circuit blocks 151 to perform differentfunctions. In accordance with embodiments, the components 210 can beharvested to obtain a specific shape or size to accommodate, or fitwithin a specified circuit block 151 area, which can have an irregularshape (e.g. non-rectangular). In this manner, the multi-component device200 does not have to overlap areas of adjacent circuit blocks. In anembodiment, the multi-component device 200 is bonded to the underside ofthe routing layer underneath a circuit block with an equivalent area asthe non-rectangular area of the multi-component device 200. In aparticular embodiment, the multi-component device 200 includes aplurality of power management ICs underneath a high power consumingcircuit block, such as a CPU, GPU, etc. As such, when stitched togethereach additional component 210 may be used to provide an addition unit ofcurrent to the corresponding circuit block. Thus, an additional currentsource can be scaled by stitching together multiple components 210. Inthe exemplary embodiment illustrated, the circuit block andcorresponding multi-component device 200 have an L-shape, though this isprovided for illustrative purposes and the multi-component devices 200in accordance with embodiments can assume a variety of irregular shapes.FIG. 11 is a schematic top view illustration for harvesting an irregularshaped multi-component device 200 from a component substrate (e.g.wafer) 202 in accordance with an embodiment.

Referring again briefly to FIG. 7 , the general principle of devicescaling is applicable for all embodiments. FIG. 12A is a schematic topview illustration multi-die set scaling with co-located dies 104 anddies 104 connected with die-to-die routing 130 in accordance with anembodiment. By way of illustration the following description is madewith regard to memory applications, though this is intended to beillustrative and embodiments are not limited to such. As shown, theharvesting techniques described can be utilized to harvest die sets 100in order to expand capacity and/or bandwidth in the context of memory.This can be applicable to a variety of memory applications such as SRAM,MRAM, DRAM, NVRAM, NAND, cache memory, etc. As shown, each die 104 caninclude an FEOL die area that includes a device area 112 andinput/output region(s) 114. Capacity may be increased by stitchingtogether a series of dies 104 with die-to-die routing 130. Bandwidth maybe increased by including additional rows of dies 104 within a die set104. In this manner, specific die set 100 capacity and bandwidth can beharvested from a wafer 102 (or wafer stack) to meet product demand, andmultiple products demands from the same source wafer 102.

While die-to-die routing 130 is illustrated only within rows of dies104, it is understood that die-to-die routing 130 can also be includedvertically between dies 104 in different rows, as originally illustratedin FIG. 1A for example. Furthermore, harvesting techniques describedherein are not limited to particular arrangements with fixed row/columnratios of dies 104 or area. It is to be appreciated that the particularillustration in FIG. 12A shows input/output regions 114 on a single sideof the dies 104. This may represent a general direction for thearrangement of external output logic. However, input/output regions 114can be located at other die edges, and in particular where there isdie-to-die routing 130. Thus, the simplified illustration in FIG. 12A,as well as other similar figures herein is understood to illustratepotential directionality of the stitched structures, and not the absenceof input/output regions 114. In accordance with embodiments, the dies,die-to-die routing 130, partial metallic seals, and full metallic sealscan be designed for flexibility in harvesting. For example, it ispossible to harvest 1× die (with its own input/output region), tomultiple dies. For example, in the embodiments illustrate din FIG. 12Athis can include 2× dies (each with its own input/output region forexternal communication), or a single input/output region for externalcommunication of the die set. In both situations, the 2× dies areinternally connected. Similarly, FIG. 12A illustrates this extension to4× dies that are internally connected. Various arrangements are possiblefor selecting which input/output regions are used for externalcommunication with the connected die set.

FIG. 12B is a schematic top view illustration multi-die set scaling withdie-to-die routing in accordance with an embodiment. In this embodiment,capacity can be increased by stitching together multiple dies 104 in thesame column rather than row. In this case, the input/output region 114can be turned off so that the lower die 104 is configured to communicatewith an outside controller through the top die 104, for example. Assuch, a number of size and area arrangements are possible.

Capacity can additionally be increased in accordance with embodiments byvertical stacking of dies 104. FIG. 13A is a schematic top viewillustration multi-die set scaling with co-located dies, and diesconnected with die-to-die routing, and stacked dies in accordance withan embodiment. FIG. 13A is substantially similar to that of FIG. 12Awith the addition that of stacked dies 104 to increase capacity.Furthermore, various die-to-die routing 130 configurations are possible.For illustrative purposes, die-to-die routing 130 is shown between thetop-most dies 104. In accordance with embodiments, die-to-die routing130 can also be provided between adjacent dies 104 (row-wise and/orcolumn-wise) within the same die level. In the exemplary embodimentillustrated, there are four die levels. Thus, dies 104 within each dielevel may be connected to one another with die-to-die routing 130. Dies104 within different die levels can additionally be connected to oneanother in various manners depending upon the die stacking fabricationtechnique implemented, such as wafer-on-wafer (WoW) and chip-on-wafer(CoW). As previously described, the stacked die areas 110 and dies 104may include distinct circuit blocks from one another. Each die area mayrepresent a complete system, or sub-system. Adjacent die areas mayperform the same or different function.

FIG. 13B is a schematic cross-sectional side view illustration of WoWstacked die sets 100 in accordance with an embodiment. FIG. 13C is aschematic cross-sectional side view illustration of chip 150 includingWoW stacked die sets in accordance with an embodiment. FIGS. 13B-13C aresimilar to that of FIGS. 3-4 with the addition of WoW stacked die sets.In such an embodiment, multiple wafers can be processed to includearrays of FEOL die areas 110 and BEOL build-up structures 120. Thewafers can then be (e.g. hybrid) bonded front-to-back, face-to-face, orback-to-back. In the particular embodiment illustrated in FIG. 13B thewafers are bonded back-to-front with the semiconductor substrate 101 ofa first wafer bonded the BEOL build-up structure 120 formed on thesecond wafer. Together the first semiconductor substrate 101 and firstBEOL build-up structure 120 can form a first die level 111, and thesecond semiconductor substrate 101 and second BEOL build-up structurecan form a second die level 113. This process can be repeated to provideadditional die levels. Also, different combinations of front-to-back,face-to-face, or back-to-back are contemplated.

WoW bonding in accordance with embodiments may include hybrid bonding,which can include both oxide-oxide and metal-metal bond interfaces.Thus, an oxide layer on a back side of the first semiconductor substrate101 can be bonded to an oxide layer in the second BEOL build-upstructure 120. Additionally, metal contact pads 140 of the second BEOLbuild-up structure may be bonded to metal contact pads 119 on the backside of the first semiconductor substrate 101. Furthermore, thesemiconductor substrates 101 may include through silicon vias 117, whichcan be connected to the contact pads 119, to accommodate verticalinterconnection. Similar to previous descriptions, the WoW and CoW diestacks can be harvested in 1X, 2X, 4X, etc. stacked die sets withflexible selection of which input/output regions are used for externalcommunication with the connected stacked die set.

Referring now to FIG. 13D a schematic top view illustration is providedof a CoW stacked die set 100 in accordance with an embodiment. In theembodiment illustrated, one or more additional dies 350 can be bonded toone or more dies 104 in the stitched die set 100. Such a technique canalso be used to partial die recovery. Also shown, the first level diescan include dies 104A and dies 104B, where dies 104B can be the same ordifferent from dies 104A (e.g. perform different function), and dies104A and 350 together can perform a useful function. As previouslydescribed the die areas and dies 104A, 104B, 350 may include distinctcircuit blocks from one another. Each die area/die may represent acomplete system, or sub-system. Adjacent and stacked die areas/dies mayperform the same or different function.

By way of illustration, various possible outcomes are shown in FIG. 13Efor stitched die 104 arrangements as previously described herein. Foroutcome (A) the left side die 104A is good, while the connected rightside die 104B is determined to be bad after testing. This is reversed inoutcome (B) where the left side die 104A is bad, while the connectedright side die 104B is good. For outcome (C) it is determined both dies104A, 104B are good. In this particular example it is presumed theinput/output region 114 of the left side die 104A is going to bepre-selected to interface with a logic chip, for example consistent withthe embodiment illustrated and described with regard to FIG. 14A. Thus,it may be necessary for the left side die 104A to be functional foroperation of the die set 100. For outcome (A) the additional die 350 canbe bonded to the left side die 104A. The combination of dies 104A and350 can then be diced and harvested. This may avoid total loss of thedie set 100. For outcome (B) however the die set 100 is not recoverable.For outcome (C) the additional die 350 can be used to increase capacityof the die set 100, for example. It is to be appreciated that while theexemplary embodiments are described with regard to two underlyingstitched dies 104A, 104B and one additional top die 350, this isprovided for illustrational purposes and embodiments are not so limited.Additionally, dies 104A, 104B may be a variety of types of dies,including XRAM, logic, etc.

In accordance with embodiments the dies 350 can be mounted face downonto the wafers 102 including the stitched die sets 100. Furtherpackaging solutions can then be employed. FIG. 13F is a schematiccross-sectional side view illustration of package 250 including achip-on-wafer stacked die set 100 in accordance with an embodiment. Inan embodiment, the dies 350 can be hybrid bonded to the BEOL build-upstructure 120 spanning over the stitched dies 104A, 104B, which mayinclude metal-metal bonds between contact pads 140 of the BEOL build-upstructure 120 and contact pads 354 of die 350, and oxide-oxide bonds. Inan embodiment, the die 350 can then be encapsulated in an encapsulationmaterial 180 (e.g. inorganic dielectric such as oxide). This may befollowed by the formation of through oxide vias to form verticalinterconnections 182. Alternatively, conductive pillars can be formed,or printed circuit board (PCB) bars can be placed adjacent to the die350 to for the vertical interconnections 182 prior to molding. A packageRDL 170 can then be formed, for example as previously described withregard to FIG. 8B. In accordance with embodiments the die 350 mayoptionally include TSVs 352 for back side connection to the RDL 170.

In some instances, the package 250 may be scribed to cut throughdie-to-die routing 130 as shown in FIG. 13G. For example, this couldoccur where the second die 104 is found to be a bad die, as previouslydescribed with regard to FIG. 13E outcome (A).

Up until this point various component and chip harvesting structureshave been described in which various combinations of components or diesets can be obtained to meet specific applications. For example, diesets can be connected with die-to-die routing or stacking to formvarious engine combinations, logic expansion, capacity expansion,bandwidth expansion, and die recovery. Various specific applicationswill now be described. It is to be appreciated however, that while someof the following examples maybe described with regard to a specificapplication, such as memory expansion, it is to be appreciated thatthese are exemplary applications and embodiments are not so limited.

Referring now to FIG. 14A is a schematic top view illustration of amemory system 400 with various examples of memory bandwidth and capacityscaling in accordance with an embodiment. FIG. 14B is a schematiccross-sectional side view illustration of the memory system 400 of FIG.14A in accordance with an embodiment. As shown, the memory system 400can include one or more chips 150 (or packages) arranged around a logicchip 402 (or package). Each chip 150 can include one or more dies 104stitched together with die-to-die routing 130. Each of the dies 104within a chip 150 can be the same type of die, or different types. Forexample, the die 104 closest to the logic chip 402 can be configured tohandle communications with the logic chip 402. For example, this firstdie 104 may be memory cache or controller memory die, which can includea buffer for partitioning signals for communication with additional dies104 further down the chain win the chip 150. As previously described thestacked die areas 110 and dies 104 may include distinct circuit blocksfrom one another. Each die area may represent a complete system, orsub-system. Adjacent die areas may perform the same or differentfunction.

In the exemplary implementation illustrated in FIG. 14B, the chips 150and logic chip 402 can be mounted on a wiring substrate 550 includingelectrical routing lines 552 with conductive bumps 174 (e.g. solder). Asshown, the input/output region 114 of the chips 150 adjacent to thelogic chip 402 can function as external input/output to communicate withthe logic chip 402 via the wiring substrate 550. It is to be appreciatedthat other packaging solutions are possible, and embodiments are not solimited.

Referring now to FIG. 14A in combination with FIG. 3 , in an embodimenta multi-die structure includes a chip 150 including a firstfront-end-of-the line (FEOL) die area 110A of a first die 104A (e.g.closest to the main logic chip 402 including a controller function)patterned into a semiconductor substrate 101 and a second FEOL die area110B of a second die 104B patterned into the semiconductor substrate101, the second FEOL die area 110B separate from the first FEOL die area110C. The first FEOL die area 110A may include a first-first side 191and a first-second side 192 opposite the first-first side, and a firstinput/output region 114A adjacent to the first-first side 191, and thesecond FEOL die area 110B includes a second-first side 193 and asecond-second side 194 opposite the second-first side, and a secondinput/output region adjacent to the second-first side 193, with thefirst-second side 192 of the first FEOL die area 110A adjacent to thesecond-first side 193 of the second FEOL die area 110B. Aback-end-of-the-line (BEOL) build-up structure 120 spans over the firstFEOL die area 110A and the second FEOL die area 110B as shown in FIG. 3, with the BEOL build-up structure 120 including a die-to-die routing130 connecting the second input/output region 114B and the first FEOLdie are 110A (for example to a corresponding input/output region of thefirst FEOL die area 110A).

Additional dies can be stitched together for additional memoryexpansion. For example, a third FEOL die area of a third die 104C canalso be patterned into the semiconductor substrate 101, with the thirdFEOL die area separate from the first FEOL die area 110A and the secondFEOL die area 110B. Similarly, the third FEOL die area can include athird-first side 195 and a third-second side 196 opposite thethird-first side 195, and a third input/output region 114C adjacent tothe third-first side 195, where the second-second side 194 of the secondFEOL die area 110B is adjacent to the third-first side 195 of the secondFEOL die area. Similarly, the BEOL build-up structure 120 spans over thethird FEOL die area, and includes a second die-to-die routing 130connecting the third input/output region 114C and the second FEOL diearea 110B (for example to a corresponding input/output region of thefirst FEOL die area 110A). As shown, a fourth die 104D with a fourthinput/output region 114D can additionally be tied to the third die 104C,and so forth.

It is to be appreciated that an actual memory system would likely havemore balanced memory, and that the illustration of different sized chips150 is for illustrational purposes only to show the potential for memoryscaling with harvested die sets.

Additional strings of stitched dies can also be located adjacent to oneanother, for example, for bandwidth expansion. Referring now to the topchip 150 of FIG. 14A including six dies 104, including a first die104A′, second die 104B′, and third die 104C′ etc. arranged similarly,and side-by-side with the first, second and third dies 104A, 104B, 104Cas previously described, with the input/output regions aligned andlocated adjacent to and electrically connected with the logic chip 402.

In accordance with embodiments, the dies of memory system 400 can be anyof, or combination of, cache memory, NAND, SRAM, MRAM, NVRAM, DRAM, orother “X”RAM.

In a particular embodiment, the first dies with external input/outputregions 114 are memory cache dies, and the following dies are othertypes of memory dies (e.g. XRAM). In an embodiment, the first die 104Aincludes an input/output (e.g. data) buffer that is not included in thefollowing stitched dies (104B, 104C, 104D, etc.). As such, the chips 150can function somewhat similar as a quad die package (QDP) load-reductionarrangement that uses a data buffer chip to reduce and minimize the loadon the server memory bus, though dies 104 can be serially connected inthe embodiment. Alternatively, where the dies are the same type of dies,similar input/output buffers can be included in the dies, though notoperated, with the internal links providing communication between dies.

In an embodiment, the dies 104A, 104A′ can be controller memory diesconfigured to communicate with the logic chip 402 and the followingstitched dies (104B, 104C, 104D, 104B′, 104C′, 104D′, etc.) are servicememory dies configured to communicate with the logic chip through thecontroller memory die. As such, the chips 150 can function somewhatsimilar as a 3D stacked registered memory modules.

Similar to previous descriptions, the chips 150 can include partialmetallic seals 122A along the die edges where die-to-die routing 130 ispresent. For example, a first partial metallic seal 122A can be locatedadjacent to the first-second side 192 of the first FEOL die area 110A,and a second partial metallic seal 122A can be located adjacent to thesecond-first side 193 of the second FEOL die area 110B, where die-to-dierouting 130 extends through first openings in the first partial metallicseal and second openings in the second partial metallic seal. Such anarrangement may be provided for all die-to-die routings 130.

The memory systems 400 in accordance with embodiments can also includestacked die sets which an additionally be combined with the stitched diesets. In this manner, stitching can occur between any or all die levelsin the stacked die sets. Furthermore, the stacked die sets can includeCoW or WoW die stacking as previously described with regard to FIGS.13A-13G.

In an embodiment, WoW die stacking may be utilized to form a multi-diestructure in the memory system 400 in which the semiconductor substrate,the first FEOL die area, second FEOL die area, and BEOL build-upstructure form a first die level 111, and a second die level 113 hybridbonded to the first die level 111. The second die level 113 may includea third front-end-of-the line (FEOL) die area of a third die patternedinto a second semiconductor substrate and a fourth FEOL die area of afourth die patterned into the second semiconductor substrate, with thefourth FEOL die area separate from the third FEOL die area similarly asthe first die level. For example, the first and second die levels caninclude stacked memory dies as shown in FIG. 13A.

In an embodiment CoW die stacking may be utilized to form a multi-diestructure in the memory system 400 in which second chips are hybridbonded face-to-face with the BEOL build-up structure, and anencapsulation material laterally (e.g. inorganic dielectric) surroundsthe second chips on the BEOL build-up structure as illustrated in FIGS.13F-13G. For example, the second chips can be an additional memory dieas shown in FIG. 13A. Front-to-back or back-to-back hybrid bonding canalso be performed rather than face-to-face hybrid bonding.

In yet an additional illustrative implementation the die harvestingtechniques can be used for scalable network systems. Referring now toFIGS. 15A-15B close-up schematic top view illustrations of harvestingnetwork dies from a wafer in accordance with embodiments. Similar topreviously described embodiments, the network dies 104 can include a diearea 110 including a device area 112 and input/output region(s) 114,which can be arranged around any edges or corners for connection withadjacent dies 104. In the particular embodiment illustrated in FIG. 15A,a 1× network single die set and 2× network multi-die set, or two 1×network dies can be scribed out from a 2×2 array of dies where there isa bad die. FIG. 15B illustrates a 4× network die set 100. Similar toprevious embodiments, partial metallic seals can be formed along the die104 edges where die-to-die routing 130 is present. Additionally, the diesets may include multiple die levels, as with CoW or WoW descriptions.As previously described the stacked die areas 110 and dies 104 mayinclude distinct circuit blocks from one another. Each die area mayrepresent a complete system, or sub-system. Adjacent die areas mayperform the same or different function.

FIG. 15C is a close-up schematic top view illustration of a network dieset 100 in accordance with an embodiment. The die set 100 of FIG. 15Cdiffers from that of FIG. 15B in location of the input/output regions114, which are located in a center area of the die set 100, which mayreduce power and latency. Also shown in FIG. 15C are full metallic seals122B and partial metallic seals 122A adjacent to the input/outputregions 114 where die-to-die routing 130 is located. At the wafer levelthe illustrated network die set 100 can be a repeating pattern acrossthe wafer. Where bad dies 104 occur, harvesting can occur similarly asdescribed with other embodiments described herein.

Referring now to FIG. 15D a close-up schematic top view illustration isprovided of an array of network dies 104 on a wafer in accordance withan embodiment. The arrangement of FIG. 15D is substantially similar tothat illustrated in FIG. 15A, with a difference being the device areas112 may correspond to essential network functions, and additionaloptional network or other functions can be located in secondary areas115. In this instance, the input/output regions 114 are located alongedges of the device areas 112, where the dies 104 may be connected withdie-to-die routing 130 running through partial metallic seals.

FIG. 15E is an illustration of a module including a plurality of logicchips 402 arranged around a harvested single die set network chip 150 inaccordance with an embodiment. FIG. 15F is an illustration of a moduleincluding a plurality of logic chips 402 arranged around a harvestedmulti-die set network chip 402 in accordance with an embodiment. In theillustrated embodiments, the dies 104 of FIG. 15D can be harvested intoan appropriately sized die set to provide scaled networking resources.The network chips 150 (or packages) can support logic chips 402 asillustrated (e.g. SOC), or can also be used to support other functions(other logic, XRAM, etc.) and may be arranged in 3D (e.g. CoW or WOW aspreviously described). Additional chips 404 can also be connected tosupport alternative functions. Thus, not all dies or chips connected tothe network chip 402 need be the same type. It is to be appreciated thatthe embodiments illustrated in FIGS. 15A-15F show rectangular, oroctagon network elements that this is illustrative, and embodiments mayalso employ other non-rectangular shapes such as triangle, hexagon,round, etc. as may be useful for other systems.

An alternative arrangement of network die harvesting is illustrated inFIGS. 15G-FIG. 15G is schematic top view layout plan illustration ofharvesting network dies 104 from wafer 102 in accordance with anembodiment. FIG. 15H is a schematic top view illustration of a die set100 including multiple network dies 104 in accordance with anembodiment. Such an implementation is similar to previous embodiments ofFIGS. 15A-15F, with a difference being that a network region 116 spansacross the input/output regions 114 on a single side of the dies 104. Inthis case various die sets 1×, 2×, 4×, 8×, 12×, etc. can be harvesteddepending upon end application and wafer 102 yield. In this case thedies 104 on opposite sides of the network region 116 can be the same ordifferent die types (perform different functions). Network regions 116in accordance with embodiments may include circuits that enablepropagation of data from one chip to the other. Such networks may becircuit switched, or packet switched networks, and may include cross-barfunctionalities. The connectivity may be linear, two dimensional, orother topologies. In addition, the network region may include cacheelements, or other logic functions. Harvesting may include dicing thenumber of units required, or even having more units than required andaccepting one or more units that fail. For example, a harvested die set100 including 12× dies may include twelve good dies, or ten good diesand two bad dies. Additionally, redundancy can be added by including oneor more extra units (dies), or complete sub-systems. In event of a unitfailure, a good unit can be swapped. Redundancy can be at the time ofmanufacture, or swappable in the field. In the illustrated embodiment,the network region 116 is much more bus-like, or similar to aninterfacing bar as will be described next, while still being integratedon-chip.

The stitching and harvesting techniques in accordance with embodimentsmay be utilized to form a variety of arrayed structures. FIG. 16A is aschematic top view illustration of both logic and memory scaling withstitched interfacing bars 500 in accordance with an embodiment. Asshown, interfacing bars 500A can function as communication bars toprovide modularity to a variety of combinations of logic chips 402including CPU, GPU, networks, caches, signal processors, glue logic,etc. and system on chip. The interfacing bars 500A in accordance withembodiments can be used to provide high bandwidth, low power, scalableconnectivity between two or more chips. Use of communication bars allowsflexibility for location of input/output (I/O) terminals on the logicdie, which do not have to be at the die/chip edges. Furthermore, thereis flexibility of start and endpoint location. In some embodiments, theinterfacing bars 500A may include an active piece of silicon, and canprovide flexibility and ease of design to the logic chips 402. Groups ofchips 150 (such as memory chips) can additionally be coupled with thelogic chips 402 with interfacing bars 500B (e.g. memory bars), which mayoptionally be placed in series to increase memory density. Thus, inaccordance with embodiments, the connectivity organization, and evenbandwidth and latency, can be tailored. Furthermore, the logic chips 402do not need to be pre-committed to providing maximum bandwidth androuting resources. The arrangement in FIG. 16A can be adjusted toprovide memory capacity and/or short logic connectivity.

The interfacing bars 500 in accordance with embodiments can be harvestedsimilarly as the dies and components described herein. For example, asshown in FIG. 16B specific sections 504 with bar-to-bar routing 530 canbe scribed to obtain larger or smaller systems. Likewise, any badsections 504 can be removed. FIG. 16C is a schematic cross-sectionalside view illustration of stitched interfacing bars 500 in accordancewith an embodiment. As shown, sections 504 can be provisioned in asubstrate 501, such as silicon substrate. Substrate 501 may includeactive silicon (or other material) to include features such as logic,repeaters, flops, cache, memory compressors and decompressors,controllers, local processing elements, etc. Other non-silicontechnologies such as, but not limited to, GaAs may also be used forsubstrate 501 if appropriate, or even optical interconnect technologies,many of which are supported by silicon. The routing layer 520 mayinclude one or more metal and dielectric layers. Routing layer 520 maybe formed using thin film technology, or traditional BEOL processingtechniques, such as damascene, etc. Routing layer 520 may include wiringlayers such as lower wiring layer, middle wiring layers, and upperwiring layers. The wiring layers may optionally have differentthicknesses, with M_high being the thickest, and M_low being thethinnest. In some embodiments, the quality of service can be used toorganize metal usage based on requirements such as latency, power, etc.In an embodiment, high priority traffic with low latency requirementscan be on the higher (thicker) layers, while bulk traffic more latencylatitude, may be in the lower (thinner) layers. Wiring layers 531 mayrun a substantial length of the sections 504 for interconnectivity,while bar-to-bar routing 530 is used to connect adjacent sections 504.The routing layer 520 may terminate with contact pads 540, which can befurther connected with various packaging sequences.

Similar solutions can also be used to harvest custom tiled interposerarrays. FIG. 17A is a schematic cross-sectional side view illustrationof a module including a plurality of chips 150 mounted on an interposer600 with connected routing areas 630 in accordance with an embodiment.FIG. 17B is a schematic top view illustration of scribe areas on aninterposer substrate 602 with connected routing areas 630 in accordancewith an embodiment. Similar to previous embodiments, sections 604 can beprovisioned in a substrate 601, such as silicon substrate, and yieldingsections 604 can be custom scribed to form interposers 600. Theinterposers 600 may include TSVs 652 for vertical connection. Routingareas 630 may be formed in a routing layer 620 similar to routing layer520. In an exemplary application, such a configuration can be utilizedform a field programmable gate array (FPGA), including chips 150 mountedon the interposer 600 with conductive bumps 174 (e.g. microbumps), withthe interposer 600 mounted onto a package substrate with conductivebumps 674. Ball grid array (BGA) balls 774 may be placed on the oppositeside of the package substrate 700 for further integration.

Up until this custom harvesting of various arrayed structures has beendescribed. In many circumstances, conventional dicing techniquesincluding blade dicing and laser ablation may be performed alongpre-determined streets or dicing areas between arrayed areas. Inaccordance with embodiments programmable dicing techniques can also beemployed to provide additional flexibility into selection of dicingareas, and to support fine dicing with reduced street width or loss ofmaterial. Two such programmable dicing techniques include laser assisteddicing (which can include laser ablation or stealth dicing, which iscleaner, less damaging, and may have a smaller scribe) and chemical etchdicing (which can be wet or plasma based).

FIG. 18 is a flow chart of a method of testing and scribing dies withprogrammable dicing in accordance with embodiments. Beginning withoperation 1802 the arrayed wafer including FEOL die areas and routinglayers to complete die-to-die routing is received. The wafer can then betested at operation 1804 to determine good and bad FEOL die areas. Thisinformation is then used to create a map at operation 1806 identifyingvalid die sets 100, and the map information is then stored at operation1808. A dicing tool then retrieves the map at operation 1810 and canperform programmable dicing at operation 1812, which may include a laserassisted dice flow sequence 1814 or chemical etch dice flow sequence1822 for example.

A laser assisted dice flow sequence 1814 can optionally include lasergrooving the front side of the wafer at operation 1816. For example,this may be a first laser cutting process (e.g. ablation) through therouting layers/BEOL build-up structure down to substrate. Thus, this caninclude cutting through die-to-die routing 130 for example. Deep laserassisted dicing operation 1818 is then performed where a laser beam ispulsed on and off to create line of damaged crystal structure. The diesare then separated at operation 1820. This may include cleaving topropagate cracks along the laser pattern.

A chemical etch dice flow sequence 1822 can include a programmable lasergroove operation 1824 similar to sequence 1814 where a laser is used tocut through the routing layers/BEOL build-up structure down tosubstrate. A mask layer can be deposited, and the patterned with a lasercutting (e.g. ablation), through both the mask layer and the BEOLbuild-up structure. This may avoid an additional lithography operation,and can be well defined (e.g. <1 μm edge). Plasma or wet chemical assistdicing may then be performed at operation 1826, where an etch mask maybe lithographically defined, followed by a plasma or wet etch partiallyor completely through the semiconductor substrate. The dies can then beseparated at operation 1828. Where partial plasma or wet etching wasperformed, this may optionally include back-grinding the semiconductorsubstrate.

Either programmable dicing technique can be used to achieve fine dicing,with mitigated material loss. This facilitates integration of densearrayed structures. Additionally, the programmable dicing techniques arevery flexible for shape, size or layout constraints. This allows thefreedom to dice die sets of any shape. This ability thus allowsadditional reliability margin improvements to the diced die sets to berealized with programmable dicing in accordance with embodiments.

Referring now to FIG. 19A, a schematic top view illustration is providedof a die set 100 before scribing in accordance with an embodiment inwhich the FEOL die areas 110 are interconnected with die-to-die routing130 through partial metallic seals 122A. A full metallic seal 122B isalso provided around the die set 100. Thus, this exemplary arrangementmay be a pre-arranged die set 100 previously described with regard toFIG. 1C. It is to be appreciated however, that this particularconfiguration is exemplary, and the following structures for reliabilitymargin improvements can be integrated into other die set 100configurations.

The die areas in accordance with embodiments may have correspondingservice structures 702 used for wafer acceptance testing, processstatistics, etc. to monitor the wafer fabrication processes, alignment,etc. As such, these services structures 702 can commonly be locatedalong die and reticle edges.

Still referring to FIG. 19A, service structures 702 can be arrangedoutside the metallic seals (e.g. outside full metallic seal 122B ring).Various service structures may include electrical test pads for testingand binning good/bad wafer acceptance test, or for controlling processstatistics for tuning, as well as alignment features, and may be formedas part of the BEOL build-up structure. As shown in FIG. 19A, one of theFEOL die areas 110 has been tested and found to be defective. Theprogrammable dicing methods in accordance with embodiments can be usedto scribe out the defective FEOL die area 110 as shown in FIG. 19B, andrecover the good die thereby improving margins. For example, theresulting structure may be similar to that of FIG. 5B. Scribing mayoptionally remove the service structures 702. Alternatively, the servicestructures 702 can be retained in the die set 100 after scribing.

Referring now to FIG. 20A a schematic top view illustration is providedof a die set 100 before scribing in accordance with an embodiment withservice structures 702 located in an unscribed scribe area 125 betweenadjacent FEOL die areas. This may not include all service structure 702,though they may be relocated to a degree possible. In this instance theservice structures 702 are located between the FEOL die areas 110, whichcan result in an increased physical interface (Phy) distance. Theservice structures 702 may be located above, under, or between(laterally, vertically) the die-to-die routing 130 lines. Referring nowto FIG. 20B, in a circumstance where one of the dies is bad, and a gooddie is recovered from the die set 100 scribing can be performed betweenthe service structures 702 for each FEOL die area 110. As a result, Phydistance is increased along this die edge to the active device area,which can help increase reliability and margin of the recovered diesince moisture, ions, and cracks would need to propagate a longerdistance. Thus, the original function of the service structures 702 canbe retained, while the increased physical distance can help improvereliability of the partial metallic seal 122A structures. In anembodiment, the die-to-die routing 130 lines, which have been cut, areelectrically isolated. Isolation can include being tristated, orotherwise being disconnected from the core circuits of the die. Thisapplies to both die-to-die routing 130 as well as to any supportingpower networks.

FIG. 21 is a schematic top view illustration of a scribed die set inaccordance with an embodiment with scribe line on an opposite side of aninput/output region 114 of an adjacent FEOL die area 110 in accordancewith an embodiment. In such an embodiment, programmable dicing can beused to provide additional protection to moisture, ions, and cracks byincluding multiple partial metallic seals 122A, and optionally a portionof the adjacent FEOL die area 110 such as the input/output region 114.As shown, dicing is through the bad die area 110. Thus, space isborrowed from the bad die to improve reliability, by increasingdistance, the number of partial metallic seals, and preserving anundamaged die-to-die routing 130. In an embodiment, internalinput/output region 114 in the FEOL die area 110 is isolated in an offstate where connected to a BEOL build-up structure contact pad, whichcan allow for external contact to be made with the additionalinput/output region 114 that remains connected with the die-to-dierouting 130. Isolation in the off state can include being tristated, orthe external die-to-die routing 130 otherwise being disconnected fromthe core circuits of the die. This may be just connected to a wire goingto the other die. It may not go to a contact pad or any other pad. Whatis needed is to have the ability to isolate the buffer (transceiver orreceiver) if the die-to-die routing 130 is cut.

Such a recovered die configuration can be designed into an end moduleapplication to accommodate the potential for additional chip 150 area,and extra conductive bump. For example, FIG. 22 illustrates a normalchip 150 mounted on a routing substrate 800 that includes an additionalunopened bond pad(s) 802, which can be covered with an insulating layer804. Where the chip 150 includes a recovered die with additional scribearea 125 and additional input/output region 114, the bond pad(s) 802 canbe opened by removal of the insulating layer, and additional conductivebumps 184 can be applied. In this manner, the die-to-die routing 130 canalso be preserved.

In an embodiment, a chip structure includes a semiconductor substrate101, a first FEOL die area 110A of a first die 104A patterned into thesemiconductor substrate 101. The first FEOL die area 110A includes afirst device area 112 and a first input/output region 114. A scribe area125 is adjacent to the first input/output region 114. A second inputoutput region 114 is also patterned into the semiconductor substrateadjacent to the scribe area 125 opposite the first input/output region114. A BEOL build-up structure 120 spans over the first device area 112,the first input/output region 114, the scribe area 125, and the secondinput/output region 114. The BEOL build up structure 120 additionallyincludes die-to-die routing 130 connecting the first input/output region114 and the second input/output region 114. In an embodiment, a scribedchip edge 152 may be adjacent to the second input/output region 114, asillustrated in FIG. 23 . Since the die-to-die routing 130 is preserved,the first input/output region can be isolated in an off state (e.g.tristated) where connected to a BEOL build-up structure contact pad 140.This may be just connected to a wire going to the other die. It may notgo to a contact pad or any other pad. What is needed is to have theability to isolate the buffer (transceiver or receiver) if thedie-to-die routing 130 is cut. Partial metallic seals 122A can also belocated adjacent to the first input/output region 114 and the secondinput/output region 114, with the die-to-die routing 130 extendingthrough first openings in the first partial metallic seal 122A andsecond openings in the second partial metallic seal 122A. Servicestructures 702 can additionally be in the scribe area 125 between thefirst input/output region 114 and the second input/output region 114.

In utilizing the various aspects of the embodiments, it would becomeapparent to one skilled in the art that combinations or variations ofthe above embodiments are possible for harvesting arrayed structures.Although the embodiments have been described in language specific tostructural features and/or methodological acts, it is to be understoodthat the appended claims are not necessarily limited to the specificfeatures or acts described. The specific features and acts disclosed areinstead to be understood as embodiments of the claims useful forillustration.

What is claimed is:
 1. A chip structure comprising: a semiconductorsubstrate; a first front-end-of-the line (FEOL) die area of a first diepatterned into the semiconductor substrate, the first FEOL die areaincluding a first device area and a first input/output region; aback-end-of-the-line (BEOL) build-up structure spanning over the firstdevice area and the first input/output region; and a chip edge adjacentto the first input/output region; wherein the BEOL build-up structurecomprises a die-to-die routing connected between the first input/outputregion and a terminal end of die-to-die routing at the chip edge.
 2. Thechip structure of claim 1, wherein the first input/output regionconnected to the die-to-die routing is isolated in an off state.
 3. Thechip structure of claim 1, wherein: the BEOL build-up structure furthercomprises a first partial metallic seal adjacent to the firstinput/output region; and the die-to-die routing extends through firstopenings in the first partial metallic seal.
 4. The chip structure ofclaim 1: further comprising a second FEOL die area of a second diepatterned into the semiconductor substrate, the second FEOL die areaincluding a second device area and a second input/output region; whereinthe first FEOL die area includes a third input/output region; andwherein the BEOL build-up structure spans over the second device area,the second input/output region, and the third input/output region, andthe BEOL build-up structure comprises a second die-to-die routingconnected between the second input/output region and the thirdinput/output region.
 5. The chip structure of claim 4, wherein: the BEOLbuild-up structure further comprises a second partial metallic sealadjacent to the second input/output region and a third partial metallicseal adjacent to the third input/output region; and the seconddie-to-die routing extends through second openings in the second partialmetallic seal and through third openings in the third partial metallicseal.
 6. The chip structure of claim 1, wherein the semiconductorsubstrate, the first FEOL die area, and BEOL build-up structure form afirst die level, the chip structure further comprising a second dielevel hybrid bonded to the first die level, the second die levelincluding a second FEOL die area of a second die patterned into a secondsemiconductor substrate.
 7. The chip structure of claim 1, furthercomprising: a second chip hybrid bonded with the BEOL build-upstructure; and an encapsulation material laterally surrounding thesecond chip on the BEOL build-up structure.
 8. An electronic structurecomprising: a routing layer; one or more dies on a top side of therouting layer; a plurality of conductive bumps on an underside of therouting layer; and a multi-component device bonded to the underside ofthe routing layer laterally adjacent to the plurality of conductivebumps, wherein the multi-component device includes a plurality ofco-located components formed in a same substrate.
 9. The electronicstructure of claim 8, wherein each component of the plurality ofco-located components includes separate terminals.
 10. The electronicstructure of claim 8, wherein the plurality of co-located componentsincludes component-to-component routing.
 11. The electronic structure ofclaim 8, wherein each component is selected from the group consisting ofa capacitor, an inductor, a resistor, and power management integratedcircuit.
 12. The electronic structure of claim 8, wherein a terminalside of the multi-component device has a non-rectangular area.
 13. Theelectronic structure of claim 26, wherein the multi-component device isbonded to the underside of the routing layer underneath a circuit blockinside one of the one or more dies with an equivalent area as thenon-rectangular area of the multi-component device.